Products & Technology
Ceramic Lid for Resin Sealing
Business fields
Overview
Ceramic lid with epoxy glue precoat is suitable for heat-sensitive devices.
Features
Function
- Ceramic Lid with epoxy glue precoat achieves hermetic seal against gross leak.
Highlights
- Ceramic Lid with epoxy glue precoat is formulated for sealing as low as 170 degree C.
- Glue volume is adjustable and can be optimaized.
- We can optimize gel time to suit customer's sealing conditions.
- Lead-free materials help reduce environmental impact.
Product usage
LDMOS and GaN RF power devices
Product Lineup
Inquiry about Electronic Components
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