CMOS Image Sensor Packages
Overview
CMOS image sensors are used in various imaging devices (single-lens reflexes, surveillance, FA, car-mounted devices, inspection, AR/VR), and their demands are increasing on the background of digitalization. Amid the increasing usages and function advancements, by leveraging our own ceramics technologies, we propose various ceramic packages that meet demands including weight reduction, high reliability, and high thermal dissipation.
Features
Small size, lightweight, and high thermal dissipation
Taking advantage of package designs that utilize high-strength ceramics, we offer products that make contributions to downsizing, weight reduction, and high thermal dissipation.
High reliability
Taking advantage of the sintering control of ceramics and inner-layer metallization, we offer packages with a high flatness.
As a result, we make contributions to the improvement of sealing reliability and element mounting accuracy.
Low dust-generation
Conventional large-size ceramic packages have the issue of shedding dust generation caused by polishing process applied.
Polishing process elimination is realized by the above-mentioned high flatness technology, we offer products with low dust-generation (defective assembly by customer).
Product usage
Commercial use
- Single-lens reflex/mirror-less cameras
- Devices related to VR/AR (metaverse)
- Game devices
Industrial use
- FA camera/machine vision (inspection/detection/monitoring)
- Surveillance cameras
- Car-mounted cameras
- Cameras for medical use
Product specifications
| Ceramics | High-strength HTCC*1 and MTCC*2 mainly made of alumina |
|---|---|
| Electrode | Tungsten, molybdenum, copper-tungsten |
| External dimension | Approx. 10 to 50 mm |
| No. of layers | 10 to 15 layers |
| Plating | Electrolytic Ni/Au, Electroless Ni/Au |
| Bonding | Various metallic members can be bonded. |
- *1HTCC: High Temperature Co-fired Ceramic
- *2MTCC: Middle Temperature Co-fired Ceramic
Inquiry about Electronic Components
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